Maximum allowable soldering conditions are:
Do not make contact between the molten solder and the resin.
Do not adjust the soldered position after soldering.
Do not put any stress on the leads, particularly when heated.
Lead Forming and Cutting
Do not put any stress to the lead frame during an assembly operation.
When mounting or inserting products into PCBs, the pitch between the mounting holes must match the pitch of the lead frame.